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| ICX098AL Diagonal 4.5mm (Type 1/4) Progressive Scan CCD Image Sensor with Square Pixel for B/W Cameras Description The ICX098AL is a diagonal 4.5mm (Type 1/4) interline CCD solid-state image sensor with a square pixel array which supports VGA format. Progressive scan allows all pixels signals to be output independently within approximately 1/30 second. Also, the adoption of monitoring mode supports 60 frame/s. This chip features an electronic shutter with variable charge-storage time which makes it possible to realize full-frame still image without a mechanical shutter. Further, high sensitivity and low dark current are achieved through the adoption of HAD (HoleAccumulation Diode) sensors. This chip is suitable for applications such as seconddimensional bar-code reader, PC input cameras, etc. Features * Progressive scan allows individual readout of the image signals from all pixels. * High horizontal and vertical resolution (both approx. 480TV-lines) still image without a mechanical shutter. * Supports monitoring mode * Square pixel * Supports VGA format * Horizontal drive frequency: 12.27MHz * No voltage adjustments (reset gate and substrate bias are not adjusted.) * High resolution, high sensitivity, low dark current * Continuous variable-speed shutter * Low smear * Excellent antiblooming characteristics * Horizontal register: 3.3V drive * 14-pin high precision plastic package (enables dual-surface standard) Device Structure * Interline CCD image sensor * Image size: * Number of effective pixels: * Total number of pixels: * Chip size: * Unit cell size: * Optical black: * Number of dummy bits: * Substrate material: 14 pin DIP (Plastic) Pin 1 2 V 8 2 Pin 8 H 31 Optical black position (Top View) Diagonal 4.5mm (Type 1/4) 659 (H) x 494 (V) approx. 330K pixels 692 (H) x 504 (V) approx. 350K pixels 4.60mm (H) x 3.97mm (V) 5.6m (H) x 5.6m (V) Horizontal (H) direction: Front 2 pixels, rear 31 pixels Vertical (V) direction: Front 8 pixels, rear 2 pixels Horizontal 16 Vertical 5 Silicon Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. -1- E98302A99 ICX098AL VOUT GND V2B V2A 7 6 VL 5 V3 4 3 2 Vertical register Horizontal register Note) : Photo sensor 8 9 10 11 12 13 14 Pin Description Pin No. 1 2 3 4 5 6 7 Symbol V1 V3 V2A V2B VL GND VOUT Description Vertical register transfer clock Vertical register transfer clock Vertical register transfer clock Vertical register transfer clock Protective transistor bias GND Signal output SUB CSUB GND Pin No. 8 9 10 11 12 13 14 RG VDD Symbol VDD GND SUB CSUB RG H1 H2 H2 H1 V1 1 Note) Block Diagram and Pin Configuration (Top View) Description Supply voltage GND Substrate clock Substrate bias1 Reset gate clock Horizontal register transfer clock Horizontal register transfer clock 1 DC bias is generated within the CCD, so that this pin should be grounded externally through a capacitance of 0.1F. Absolute Maximum Ratings Item VDD, VOUT, RG - SUB V2A, V2B - SUB Against SUB V1, V3, VL - SUB H1, H2, GND - SUB CSUB - SUB VDD, VOUT, RG, CSUB - GND Against GND V1, V2A, V2B, V3 - GND H1, H2 - GND Against VL V2A, V2B - VL V1, V3, H1, H2, GND - VL Voltage difference between vertical clock input pins Between input H1 - H2 clock pins H1, H2 - V3 Storage temperature Operating temperature 2 +24V (Max.) when clock width < 10s, clock duty factor < 0.1%. -2- Ratings -40 to +10 -50 to +15 -50 to +0.3 -40 to +0.3 -25 to -0.3 to +18 -10 to +18 -10 to +5 -0.3 to +28 -0.3 to +15 to +15 -5 to +5 -13 to +13 -30 to +80 -10 to +60 Unit V V V V V V V V V V V V V C C 2 Remarks ICX098AL Bias Conditions Item Supply voltage Protective transistor bias Substrate clock Reset gate clock Symbol VDD VL SUB RG Min. 14.55 Typ. 15.0 1 2 2 Max. 15.45 Unit V Remarks 1 VL setting is the VVL voltage of the vertical transfer clock waveform, or the same power supply as the VL power supply for the V driver should be used. 2 Do not apply a DC bias to the substrate clock and reset gate clock pins, because a DC bias is generated within the CCD. DC Characteristics Item Supply current Symbol IDD Min. Typ. 6.0 Max. Unit mA Remarks Clock Voltage Conditions Item Readout clock voltage VVT VVH02A VVH1, VVH2A, VVH2B, VVH3 VVL1, VVL2A, VVL2B, VVL3 Vertical transfer clock voltage V1, V2A, V2B, V3 | VVL1 - VVL3 | VVHH VVHL VVLH VVLL Horizontal transfer clock voltage Reset gate clock voltage Substrate clock voltage VH VHL VRG VRGLH - VRGLL VRGL - VRGLm VSUB 19.75 20.5 -3- 3.0 -0.05 3.0 3.3 0 3.3 Symbol Min. 14.55 -0.05 -0.2 -5.8 5.2 Typ. 15.0 0 0 -5.5 5.5 Max. 15.45 0.05 0.05 -5.2 5.8 0.1 0.3 1.0 0.5 0.5 5.25 0.05 5.5 0.4 0.5 21.25 Unit V V V V V V V V V V V V V V V V Waveform diagram 1 2 2 2 2 2 2 2 2 2 3 3 4 4 4 5 Low-level coupling Low-level coupling High-level coupling High-level coupling Low-level coupling Low-level coupling VVL = (VVL1 + VVL3)/2 VVH = VVH02A Remarks ICX098AL Clock Equivalent Circuit Constant Item Capacitance between vertical transfer clock and GND Symbol CV1 CV2A, CV2B CV3 CV12A, CV2B1 Capacitance between vertical transfer clocks Capacitance between horizontal transfer clock and GND Capacitance between horizontal transfer clocks Capacitance between reset gate clock and GND Capacitance between substrate clock and GND CV2A3, CV32B CV13 CH1, CH2 CHH CRG CSUB R1 Vertical transfer clock series resistor R2A, R2B R3 Vertical transfer clock ground resistor Horizontal transfer clock series resistor Horizontal transfer clock ground resistor Reset gate clock series resistor V1 CV12A Min. Typ. 1200 470 2200 470 390 10 22 68 3 220 20 43 36 43 12 30 62 Max. Unit pF pF pF pF pF pF pF pF pF pF k Remarks RGND RH RH2 RRG V2A R1 R2A RH H1 RH H2 CHH CV2A3 CV13 CH1 CH2 RH2 CV1 CV2B1 CV2A CV2B RGND CV3 R2B CV32B R3 V2B V3 Vertical transfer clock equivalent circuit Horizontal transfer clock equivalent circuit RRG RG CRG Reset gate clock equivalent circuit -4- ICX098AL Drive Clock Waveform Conditions (1) Readout clock waveform VT 100% 90% II II M M 2 tf 0V VVT 10% 0% tr twh Note) Readout clock is used by composing vertical transfer clocks V2A and V2B. (2) Vertical transfer clock waveform V1 VVHL VVH1 VVHH VVH VVLH VVL01 VVL1 VVLL V2A, V2B VVH02A, VVH02B VVHH VVHL VVH2A, VVH2B VVL VVH VVLH VVL2A, VVL2B VVLL V3 VVHL VVH3 VVL VVHH VVH VVL03 VVLL VVLH VVL VVH = VVH02A VVL = (VVL01 + VVL03) /2 VVL3 = VVL03 VV1 = VVH1 - VVL01 VV2A = VVH02A - VVL2A VV2B = VVH02B - VVL2B VV3 = VVH3 - VVL03 -5- ICX098AL (3) Horizontal transfer clock waveform tr H2 90% VCR VH 10% H1 two VH 2 twh tf twl VHL Cross-point voltage for the H1 rising side of the horizontal transfer clocks H1 and H2 waveforms is VCR. The overlap period for twh and twl of horizontal transfer clocks H1 and H2 is two. (4) Reset gate clock waveform tr twh tf RG waveform VRGH twl VRG Point A VRGLH VRGLL VRGLm VRGL VRGLH is the maximum value and VRGLL is the minimum value of the coupling waveform during the period from Point A in the above diagram until the rising edge of RG. In addition, VRGL is the average value of VRGLH and VRGLL. VRGL = (VRGLH + VRGLL)/2 Assuming VRGH is the minimum value during the interval twh, then: VRG = VRGH - VRGL Negative overshoot level during the falling edge of RG is VRGLm. (5) Substrate clock waveform 100% 90% M VSUB 10% 0% VSUB (A bias generated within the CCD) M 2 tf tr twh -6- ICX098AL Clock Switching Characteristics Item Readout clock Vertical transfer clock Horizontal transfer clock During imaging Symbol VT V1, V2A, V2B, V3 H1 H2 25.5 30.5 28 33 28 33 9 9 0.01 0.01 11 12 63.5 3 16.5 14 twh twl tr tf Unit s 350 9 9 0.01 0.01 3 16.5 14 ns ns Remarks During readout 1 2 Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. 2.3 2.5 0.5 15 0.5 25.5 30.5 During H1 parallel-serial H2 conversion RG SUB s ns During drain charge Reset gate clock Substrate clock 1.5 1.8 0.5 0.5 s 1 When vertical transfer clock driver CXD1267AN is used. 2 tf tr - 2ns, and the cross-point voltage (VCR) for the H1 rising side of the H1 and H2 waveforms must be at least VH/2 [V]. two Item Horizontal transfer clock Symbol H1, H2 Min. Typ. Max. 21.5 25.5 Unit ns Remarks Spectral Sensitivity Characteristics (excludes lens characteristics and light source characteristics) 1 0.9 0.8 0.7 Relative Response 0.6 0.5 0.4 0.3 0.2 0.1 0 400 500 600 700 Wave Length [nm] 800 900 1000 -7- ICX098AL Image Sensor Characteristics Item Symbol Min. Typ. Max. Unit Measurement method 1 2 3 4 4 5 6 7 (Ta = 25C) Remarks 1/30s accumulation mode Ta = 60C 1/30s accumulation mode Zone 0 and I Zone 0 to II' Ta = 60C Ta = 60C Sensitivity Saturation signal Smear S Vsat Sm 480 500 600 mV mV 0.001 0.0025 20 25 4 1 0.5 % % % mV mV % Video signal shading Dark signal Dark signal shading Lag SH Vdt Vdt Lag Zone Definition of Video Signal Shading 659 (H) 12 12 12 H 8 H 8 V 10 494 (V) Zone 0, I Zone II, II' V 10 10 Ignored region Effective pixel region Measurement System CCD signal output [A] CCD C.D.S AMP S/H Signal output [B] Note) Adjust the amplifier gain so that the gain between [A] and [B] equals 1. -8- ICX098AL Image Sensor Characteristics Measurement Method Readout modes The diagram below shows the output methods for the following two readout modes. Progressive scan mode 7 6 5 4 3 2 1 VOUT VOUT Monitoring mode 7 6 5 4 3 2 1 Note) Blacked out portions in the diagram indicate pixels which are not read out. 1. Progressive scan mode In this mode, all pixel signals are output in non-interlace format in 1/30s. The vertical resolution is approximately 480TV-lines and all pixel signals within the same exposure period are read out simultaneously, making this mode suitable for high resolution image capturing. 2. Monitoring mode The signals for all effective areas are output in approximately 1/60s by repeating readout pixels and non-readout pixels every two lines. The vertical resolution is approximately 240TV-lines. This readout mode emphasizes processing speed over vertical resolution. -9- ICX098AL Measurement conditions 1) In the following measurements, the device drive conditions are at the typical values of the bias and clock voltage conditions. 2) In the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical black level (OB) is used as the reference for the signal output, which is taken as the value measured at point [B] of the measurement system. Definition of standard imaging conditions 1) Standard imaging condition I: Use a pattern box (luminance : 706cd/m2, color temperature of 3200K halogen source) as a subject. (pattern for evaluation is not applicable.) Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter and image at F8. The luminous intensity to the sensor receiving surface at this point is defined as the standard sensitivity testing luminous intensity. 2) Standard imaging condition II: Image a light source (color temperature of 3200K) with a uniformity of brightness within 2% at all angles. Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter. The luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm. 1. Sensitivity Set to standard imaging condition I. After selecting the electronic shutter mode with a shutter speed of 1/100s, measure the signal output (VS) at the center of the screen, and substitute the value into the following formula. S = VS x 100 [mV] 30 2. Saturation signal Set to standard imaging condition II. After adjusting the luminous intensity to 10 times the intensity with the average value of the signal output, 150mV, measure the minimum value of the signal output. 3. Smear Set to standard imaging condition II. With the lens diaphragm at F5.6 to F8, first adjust the luminous intensity to 500 times the intensity with the average value of the signal output, 150mV. Then after the readout clock is stopped and the charge drain is executed by the electronic shutter at the respective H blankings, measure the maximum value (Vsm [mV]) of the signal output and substitute the value into the following formula. Sm = Vsm 1 1 x x 150 500 10 x 100 [%] (1/10V method conversion value) 4. Video signal shading Set to standard imaging condition II. With the lens diaphragm at F5.6 to F8, adjust the luminous intensity so that the average value of the signal output is 150mV. Then measure the maximum (Vmax [mV]) and minimum (Vmin [mV]) values of the signal output and substitute the values into the following formula. SH = (Vmax - Vmin)/150 x 100 [%] 5. Dark signal Measure the average value of the signal output (Vdt [mV]) with the device ambient temperature 60C and the device in the light-obstructed state, using the horizontal idle transfer level as a reference. - 10 - ICX098AL 6. Dark signal shading After measuring 5, measure the maximum (Vdmax [mV]) and minimum (Vdmin [mV]) values of the dark signal output and substitute the values into the following formula. Vdt = Vdmax - Vdmin [mV] 7. Lag Adjust the signal output value generated by strobe light to 150mV. After setting the strobe light so that it strobes with the following timing, measure the residual signal (Vlag). Substitute the value into the following formula. Lag = (Vlag/150) x 100 [%] VD V2A Light Strobe light timing Signal output 150mV Output Vlag (Lag) - 11 - Drive Circuit 15V 20 19 18 100 -5.5V 3.3/16V 1 2 3 XSUB XV1 XV2A 22/16V 12 345 6 7 4 5 6 7 8 12 CXD1267AN 17 16 15 14 13 2SK523 V2A V2B GND VOUT XV3 V1 V3 VL XSG1 XV2B XSG2 11 9 10 CCD OUT 3.9K 22/20V ICX098 (Bottom View) RG H2 H1 CSUB 14 13 12 11 10 9 100K 0.1 1/35V SUB GND 8 VDD - 12 - 0.1 1/20V 33/20V 0.01 2200p 1M H2 H1 RG ICX098AL ICX098AL Sensor Readout Clock Timing Chart Progressive Scan Mode XV1 XV2A XV2B XV3 XSG1 XSG2 Sensor readout clocks XSG1 and XSG2 are used by composing XV2A and XV2B. 81.4ns (1 bit) HD 2.53s (31 bits) 42.2s (520 bits) V1 V2A V2B V3 - 13 - ICX098AL Sensor Readout Clock Timing Chart Monitoring Mode XV1 XV2A XV2B XV3 XSG1 XSG2 Sensor readout clock XSG1 is used by composing XV2A. 81.4ns (1 bit) HD 2.53s (31 bits) 42.2s (520 bits) V1 V2A V2B V3 - 14 - Drive Timing Chart (Vertical Sync) Progressive Scan Mode VD HD 504 510 520 525 1 2 3 4 5 6 7 12 345 6 7 81 2 V1 V2A V2B V3 525 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 CCD OUT 494 - 15 - 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 9 1011 ICX098AL Drive Timing Chart (Vertical Sync) Monitoring Mode FLD VD BLK HD 260 261 262 263 264 265 270 275 280 285 1 2 5 6 1 2 5 6 9 10 13 14 17 18 520 V1 V2A V2B V3 525 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 1 2 5 6 1 2 5 6 9 10 13 14 17 18 CCD OUT 486 489 490 493 494 486 489 490 493 494 - 16 - ICX098AL Drive Timing Chart (Horizontal Sync) Progressive Scan Mode HD 1 78 780 BLK 140 CLK H1 H2 V1 V2A - 17 - V2B V3 SUB RG SHP SHD ICX098AL Drive Timing Chart (Horizontal Sync) Monitoring Mode HD 78 1 780 BLK 140 CLK H1 H2 V1 - 18 - V2A V2B V3 SUB RG SHP SHD ICX098AL ICX098AL Notes on Handling 1) Static charge prevention CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non-chargeable gloves, clothes or material. Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensor. e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges. 2) Soldering a) Make sure the package temperature does not exceed 80C. b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a ground 30W soldering iron and solder each pin in less than 2 seconds. For repairs and remount, cool sufficiently. c) To dismount an image sensor, do not use a solder suction equipment. When using an electric desoldering tool, use a thermal controller of the zero cross On/Off type and connect it to ground. 3) Dust and dirt protection Image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and dirt. Clean glass plates with the following operation as required, and use them. a) Perform all assembly operations in a clean room (class 1000 or less). b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air is recommended.) c) Clean with a cotton bud and ethyl alcohol if the grease stained. Be careful not to scratch the glass. d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving to a room with great temperature differences. e) When a protective tape is applied before shipping, just before use remove the tape applied for electrostatic protection. Do not reuse the tape. 4) Installing (attaching) a) Remain within the following limits when applying a static load to the package. Do not apply any load more than 0.7mm inside the outer perimeter of the glass portion, and do not apply any load or impact to limited portions. (This may cause cracks in the package.) Cover glass 50N Plastic package Compressive strength 50N 1.2Nm Torsional strength - 19 - ICX098AL b) If a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the bottom of the package. Therefore, for installation, use either an elastic load, such as a spring plate, or an adhesive. c) The adhesive may cause the marking on the rear surface to disappear, especially in case the regulated voltage value is indicated on the rear surface. Therefore, the adhesive should not be applied to this area, and indicated values should be transferred to the other locations as a precaution. d) The notch of the package is used for directional index, and that can not be used for reference of fixing. In addition, the cover glass and seal resin may overlap with the notch of the package. e) If the lead bend repeatedly and the metal, etc., clash or rub against the package, the dust may be generated by the fragments of resin. f) Acrylate anaerobic adhesives are generally used to attach CCD image sensors. In addition, cyanoacrylate instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives. (reference) 5) Others a) Do not expose to strong light (sun rays) for long periods. For continuous using under cruel condition exceeding the normal using condition, consult our company. b) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions. c) The brown stain may be seen on the bottom or side of the package. But this does not affect the CCD characteristics. d) This package has 2 kinds of internal structure. However, their package outline, optical size, and strength are the same. Structure A Package Chip Metal plate (lead frame) Structure B Cross section of lead frame The cross section of lead frame can be seen on the side of the package for structure A. - 20 - Package Outline Unit: mm 14 pin DIP (400mil) A 0 to 9 5.0 14 8 D C 8 14 ~ 10.16 7.0 ~ 2.5 5.0 V H 1 7 7 1 0.5 B' 1. "A" is the center of the effective image area. 1.0 3.35 0.15 7.0 2.5 2. The two points "B" of the package are the horizontal reference. The point "B'" of the package is the vertical reference. 3. The bottom "C" of the package, and the top of the cover glass "D" are the height reference. 4. The center of the effective image area relative to "B" and "B'" is (H, V) = (5.0, 5.0) 0.15mm. 5. The rotation angle of the effective image area relative to H and V is 1. 1.27 0.3 M 2.6 ~ 1.27 3.5 0.3 0.3 0.46 6. The height from the bottom "C" to the effective image area is 1.41 0.10mm. The height from the top of the cover glass "D" to the effective image area is 1.94 0.15mm. 7. The tilt of the effective image area relative to the bottom "C" is less than 25m. The tilt of the effective image area relative to the top "D" of the cover glass is less than 25m. 8. The thickness of the cover glass is 0.75mm, and the refractive index is 1.5. 9. The notch of the package is used only for directional index, that must not be used for reference of fixing. PACKAGE STRUCTURE PACKAGE MATERIAL Plastic LEAD TREATMENT GOLD PLATING LEAD MATERIAL 42 ALLOY PACKAGE WEIGHT 0.6g 0.25 1.0 8.9 10.0 0.1 8.9 10.0 0.1 1.7 B 1.7 2.5 - 21 - ICX098AL |
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